Dip & Bake Method (Piece in Vertical Axis, in Static Position, Pre-heated and Not Pre-Heated) merges with Hot & Cold Dipping Methods, where there is the presence of a Thermo-ventilated Oven for the pre & post Impregnation Thermal cycles. It gives the piece a fair absorption in terms of quantity of Resin on the Copper winding, while on the Core Lamination (Intra-Lamination effect) it seems not to have big advantages. Cold Dipping Technology is Worldwide largely used and is suggested to Impregnate all those electrical products where working stresses are very low or those components for which other methods can not be used (for instance: Transformers, Coils,Bobbins) and also in case of production in batches, so that there is no necessity of a continuous impregnation plant . The resin’s solid content after dripping is very low.